A BGA (Ball Grid Array) is a type of surface mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins that can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performances at high speeds.
Our PDR IR-D35Vi BGA placement system provides us with extremely high levels of profiling and process control necessary for the effective placement and rework of even the most advanced packages, including SMDs, BGAs, uBGAs, CSPs and QFNs.
The PDR IR-D35Vi has the following feature list:
Contact us to discuss your requirements.