Over the last 18 months, investment at European Circuits Limited has continued with the installation of additional equipment in both our PCB Manufacturing Area and PCB Assembly Area.
The investment in excess of £350,000 includes an additional CNC Drill / Routing Machine, additional ATE tester, Solder Paste Inspection System, several new Pick & Place machines and a 3D AOI System. The installation of this equipment improves our efficiency and ensures we are at the leading edge of PCB manufacture and assembly in the UK.
The MV-3 OMNI Desktop 3D AOI Machine is configured with the same hardware and software as MIRTEC’s in-line OMNI-VISION 3D Inspection Systems. These systems feature the company’s OMNI-VISION 3D Inspection Technology which combines 15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s Digital Tri-Frequency Moiré 3D system in a cost-effective platform. MIRTEC’s Twelve projection Digital Tri-Frequency Moiré Technology provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow.
The Mx400 Series machines have a dual gantry structure based on two 6 axes head. Dual lane conveyor enables two PCBs to work simultaneously for improving productivity. Their economical compact size ensures maximum productivity per unit area.
The MS-11 In-Line SPI System uses Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste deposition on PCBs post screen printing. The MS-11 will inspect for; insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11 is configured with a 10M pixel or the 15M pixel ISIS Vision System for enhanced image quality, superior accuracy and lightening fast inspection rates. The MS-11 uses the same robust platform as MIRTEC’s MV-7 Series. Inspection heads are interchangeable between the two systems, adding ultimate flexibility to the inspection process.