Ever wondered how we go about producing a Printed Circuit Board here in Glasgow?
The following gives a simplified step by step overview of the standard manufacturing process for a PTH PCB:
STEP 1 – Film Generation
Generated from gerber files, a film representation of the board layout is produced. A film is required for each ‘layer’ – i.e copper layers, solder resist, legend, etc.
STEP 2 – Cut Raw Material
For a standard PTH board, double sided copper clad FR4 would be used, typically 1.6mm thick.
STEP 3 – Drill Holes
Drill hole pattern using NC drill machines.
STEP 4 – Copper Plating
Apply copper plating in hole barrels.
STEP 5 – Apply Image
Apply photosensitive dry film (plate resist) to panel. Use UV light source and film to expose panel. Develop selected areas from panel.
STEP 6 – Pattern Plating
Electrochemical process to build copper in the holes and on the trace area.
STEP 7 – Etch & Strip
Remove dry film then etch exposed copper.
STEP 8 – Solder Mask
Apply solder mask area to entire board with the exception of solder pads.
STEP 9 – Board Finish
Apply HASL (Hot Air Solder Levelling). Hot air knives level the solder.
Alternative finishes such as nickel gold available.
STEP 10 – Legend
Apply component idents using silk screen printing process.
